Inventors: Dr. Vadiraj Anant Hemadri, Dr. Siddhartha Tripathi

The development focuses on creating advanced heat pipes with superhydrophobic and superhydrophilic surfaces, along with wettability gradients, to improve cooling efficiency for high-density electronics. Superhydrophobic surfaces repel water, enhancing heat transfer by minimizing liquid accumulation and improving thermal conductivity. Superhydrophilic surfaces promote rapid liquid spreading and heat dissipation.